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This document will go through an overview of a PCB mill machine including important information on operating the system and the associated software programs and will also describe a typical production process.  

This document will go through an overview of a PCB mill machine including important information on operating the system and the associated software programs and will also describe a typical production process.  

=== '''Background''' ===

== Background ==

A Printed Circuit Board (PCB) is a board that has pads that are connected with traces (lines) which make a circuit. It allows electrical components to be connected and get power when they are soldered to this board.  

A Printed Circuit Board (PCB) is a board that has pads that are connected with traces (lines) which make a circuit. It allows electrical components to be connected and get power when they are soldered to this board.  

* <u>Copper</u>: The copper is the conductive material in the board. It can be only on one side of the board or more commonly on both sides to have a double-sided board.   

* <u>Copper</u>: The copper is the conductive material in the board. It can be only on one side of the board or more commonly on both sides to have a double-sided board.   

* <u>Soldermask</u>:The next layer, the soldermask, is placed on top of the copper to avoid unwanted contact from other conductive elements.   

* <u>Soldermask</u>:The next layer, the soldermask, is placed on top of the copper to avoid unwanted contact from other conductive elements.   

* <u>Silkscreen</u>:The white silkscreen is then placed on top to indicate the position of different components or any notations you would like to add.  

* <u>Silkscreen</u>:The white silkscreen is then placed on top to indicate the position of different components or any notations you would like to add.  

Figure 1 shows a 2-layer board, but more inner layers can be created by sandwiching multiple 2-layer substrates.

Figure 1 shows a 2-layer board, but more inner layers can be created by sandwiching multiple 2-layer substrates. If connections need to be made between layers, then holes need to be drilled then plated through inside with metal to make the connection between the layers (Figure 2). These holes are called vias. We are making a 2-layer through hole board, which means our components will have pins that pass through the PCB and will be soldered on the opposite side.  

 

If connections need to be made between layers, then holes need to be drilled then plated through inside with metal to make the connection between the layers (Figure 2). These holes are called vias.  

 

We are making a 2-layer through hole board, which means our components will have pins that pass through the PCB and will be soldered on the opposite side.  

[[File:PCB internal routes.png|center|PCB Internal routes|link=Special:FilePath/PCB_internal_routes.png]]

[[File:PCB internal routes.png|center|PCB Internal routes|link=Special:FilePath/PCB_internal_routes.png]]

Figure 2. PCB internal routes  

Figure 2. PCB internal routes  

Through hole vias are the most common and the cheapest, since it is easiest to drill a hole all the way through a piece of material with layers that have already been sandwiched together.  

Through hole vias are the most common and the cheapest, since it is easiest to drill a hole all the way through a piece of material with layers that have already been sandwiched together.  

'''Safety'''

== Safety ==

 

This section provides an overview of all important safety aspects for protecting persons as well as for a safe and fault-free operation of the system.  

This section provides an overview of all important safety aspects for protecting persons as well as for a safe and fault-free operation of the system.  

* Drilling of plane materials using drilling tools  

* Drilling of plane materials using drilling tools  

'''Materials'''

=== Materials ===

 

* GFRP or CFRP base material  

* GFRP or CFRP base material  

* Necuron ®  

* Necuron ®  

'''Safety rules'''

=== Safety rules ===

 

* Never grasp moving components when the system is operating.  

* Never grasp moving components when the system is operating.