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[[File:PCB Composition.png|center|PCB Composition]]
[[File:PCB Composition.png|center|PCB Composition]]
<Figure 1. PCB composition style="text-align: center;">
* <u>Substrate (FR4)</u>: The substrate (FR4) is fiberglass which gives the board rigidity and insulates each side from the other.
* <u>Substrate (FR4)</u>: The substrate (FR4) is fiberglass which gives the board rigidity and insulates each side from the other.
Figure 2. PCB internal routes
Figure 2. PCB internal routes
Through hole vias are the most common and the cheapest, since it is easiest to drill a hole all the way through a piece of material with layers that have already been sandwiched together.
Through hole vias are the most common and the cheapest, since it is easiest to drill a hole all the way through a piece of material with layers that have already been sandwiched together.
== Safety ==
== Safety ==